Description
– Board Thickness: 1.2 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 12 mil (0.3 mm)
– Minimum Hole Diameter: 0.4 mm
– Solder Mask Color: Green
– Surface Finishes: OSP
– Board Thickness: 1.2 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 12 mil (0.3 mm)
– Minimum Hole Diameter: 0.4 mm
– Solder Mask Color: Green
– Surface Finishes: OSP
– Board Thickness: 1.2 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 12 mil (0.3 mm)
– Minimum Hole Diameter: 0.4 mm
– Solder Mask Color: Green
– Surface Finishes: OSP
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