Feature phone PCB (G191)
– Layer: Multi-Layer
– Material: FR4
– Board Thickness: 1 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 3 mil (0.0762 mm)
– Minimum Hole Diameter: 0.2 mm
– Solder Mask Color: Blue
– Surface Finishes: ENIG
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Feature phone PCB (i700)
– Layer: Multi-Layer
– Material: FR4
– Board Thickness: 1 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 3 mil (0.0762 mm)
– Minimum Hole Diameter: 0.2 mm
– Solder Mask Color: Black
– Surface Finishes: ENIG
Feature phone PCB (MM26i)
– Layer: Multi-Layer
– Material: FR4
– Board Thickness: 1 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 3 mil (0.0762 mm)
– Minimum Hole Diameter: 0.2 mm
– Solder Mask Color: Green
– Surface Finishes: ENIG