Description
‘- Board Thickness: 1.6 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 3 mil (0.075 mm)
– Minimum Hole Diameter: 0.2 mm
– Solder Mask Color: Green
– Surface Finishes: ENIG
Feature Phone PCB
‘- Board Thickness: 1.6 mm
– Copper Thickness: 35 µm
– Minimum Line Width: 3 mil (0.075 mm)
– Minimum Hole Diameter: 0.2 mm
– Solder Mask Color: Green
– Surface Finishes: ENIG
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