Feature phone PCB (MM26i)

Description

Multilayer PCB is a compact and efficient design tailored to meet the requirements of Walton feature phones. These PCBs incorporate advanced manufacturing techniques to ensure durability, performance, and reliability in compact electronic devices.

• Multilayer Design: Typically 4 layers to accommodate high-density interconnections.
• Material: High-quality copper-clad laminates (CCL) for signal integrity and heat resistance.
• Size Optimization: Ultra-thin profile to fit compact phone designs.

Manufacturing Highlights:

• Drilling and Routing: High-precision drilling for micro vias and smooth edge routing to meet design tolerances.
• Copper Plating: Uniform plating for conductivity and signal performance.
• Etching and Lamination: Ensures high precision for circuit pathways and robust interlayer bonding.
• Surface Finish: ENIG (Electroless Nickel Immersion Gold) for long shelf life and solderability.
• Quality Control: Rigorous electrical testing and AOI (Automated Optical Inspection) to eliminate defects.

This multilayer PCB ensures optimal functionality for feature phones by supporting seamless integration of processors, displays, and communication modules.